Integrated Cooling Channels in Direct Bonded Copper Substrates for Silicon Carbide MOSFETs

Nuremberg / VDE (2018) [Buchbeitrag]

PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Seite(n): 1400-1407

Autorinnen und Autoren

Autorinnen und Autoren

Stippich, Alexander
Battefeld, Maximilian
de Doncker, Rik W.

Identifikationsnummern

  • REPORT NUMBER: RWTH-2018-226195