Integrated Cooling Channels in Direct Bonded Copper Substrates for Silicon Carbide MOSFETs
Nuremberg / VDE (2018) [Buchbeitrag]
PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Seite(n): 1400-1407
Autorinnen und Autoren
Autorinnen und Autoren
Stippich, Alexander
Battefeld, Maximilian
de Doncker, Rik W.
Identifikationsnummern
- REPORT NUMBER: RWTH-2018-226195