Ultra-High Power Density Full-SiC Boost Converter Enabled by Advanced 3D-Printing Techniques

Wienhausen, Arne Hendrik; Sewergin, Alexander; de Doncker, Rik W.

New York, NY : IEEE (2019)
Buchbeitrag, Beitrag zu einem Tagungsband

In: APEC 2019 : Thirty-Fourth Annual IEEE Applied Power Electronics Conference : March 17-21, 2019, Anaheim, California / the sponsors: Power Sources Manufacturers Association, IEEE Power Electronics Society, IEEE Industry Applications Society
Seite(n)/Artikel-Nr.: 1281-1288