Ultra-High Power Density Full-SiC Boost Converter Enabled by Advanced 3D-Printing Techniques
New York, NY / IEEE (2019) [Buchbeitrag, Beitrag zu einem Tagungsband]
APEC 2019 : Thirty-Fourth Annual IEEE Applied Power Electronics Conference : March 17-21, 2019, Anaheim, California / the sponsors: Power Sources Manufacturers Association, IEEE Power Electronics Society, IEEE Industry Applications Society
Seite(n): 1281-1288
Autorinnen und Autoren
Autorinnen und Autoren
Wienhausen, Arne Hendrik
Sewergin, Alexander
de Doncker, Rik W.
Identifikationsnummern
- DOI: 10.1109/APEC.2019.8721856
- REPORT NUMBER: RWTH-2019-07271