A thermal modeling methodology for power semiconductor modules

Amsterdam [u.a.] / Elsevier (2015) [Contribution to a conference proceedings, Journal Article]

Microelectronics reliability
Volume: 55
Issue: 9/10
Page(s): 1938-1944

Authors

Authors

van der Broeck, Christoph Henrik
Conrad, Marcus
de Doncker, Rik W.

Identifier