Significance of thermal cross-coupling effects in power semiconductor modules
Piscataway, NJ] / IEEE (2016) [Contribution to a book, Contribution to a conference proceedings]
2016 IEEE 2nd Annual Southern Power Electronics Conference (SPEC) : Auckland, New Zealand, December 5-8, 2016 / [sponsors: IEEE, IEEE Power Electronics Society, the University of Auckland [und 2 andere]]
Page(s): 1-6
Authors
Authors
Stippich, Alexander
Neubert, Markus Erich
Sewergin, Alexander
de Doncker, Rik W.
Identifier
- DOI: 10.1109/SPEC.2016.7846075
- REPORT NUMBER: RWTH-2018-221296