Packaging technologies for power electronics in automotive applications

Aachen / Institut für Stromrichtertechnik und Elektrische Antriebe ISEA (2017, 2018) [Book, Dissertation / PhD Thesis]

Page(s): 1 Online-Ressource (iv, 132 Seiten) : Illustrationen

Abstract

A press-pack concept and high-current printed circuit boards with embedded power semiconductor chips are investigated as alternative packaging technologies for IGBT power modules in terms of cooling performance, switching losses and dc-link inductance. Thermal and electrical module models, which are derived from simulations and validated by measurements, are used to compare the module concepts on inverter system level with particular consideration of the application of the reverseconducting IGBT.

Authors

Authors

Neeb, Christoph

Advisors

de Doncker, Rik W.
Knoch, Joachim

Identifier

  • REPORT NUMBER: RWTH-2018-224569