Comparison of High Performance Cooling Concepts for SiC Power Modules

Piscataway, NJ / IEEE (2019) [Contribution to a book, Contribution to a conference proceedings]

APEC 2019 : Thirty-Fourth Annual IEEE Applied Power Electronics Conference : March 17-21, 2019, Anaheim, California / the sponsors: Power Sources Manufacturers Association, IEEE Power Electronics Society, IEEE Industry Applications Society
Page(s): 2822-2825

Authors

Authors

Sewergin, Alexander
Stippich, Alexander
Wienhausen, Arne Hendrik
de Doncker, Rik W.

Identifier